Automated Sequential Controller for Pre-Seal Bake Process of Microelectronic Packages

Microelectronic Substrates for Optoelectronic Packages

lectronic systems with the increased functionality and speed required in today’s advanced applications are placing a performance burden on the interconnection and packaging technologies that standard electrical “wiring” approaches simply cannot support. Engineering staff at APL recognized this trend several years ago, and in a collaborative effort with The Johns Hopkins University Department of...

Fast Qualification Methods for Microelectronic Packages

Ultrasonic Cure Monitoring of Photoresist During Pre-Exposure Bake Process

We have developed a sensor to measure the glass transition temperature (T,) of photoresist during its pre-exposure bake. During prebake, the resist must reach this temperature in order for significant solvent evaporation to occur. To determine T, we measured the change in phase of a high frequency pulse as it was reflected from the interface between an 8” silicon wafer and a photoresist film. T...

A Thermomechanical Model for Warpage Prediction of Microelectronic Packages

The thermomechanical warpage or vertical deflection of microelectronic packages due to temperature change is caused by the mismatch in the coefficients of thermal expansion between vertically asymmetric layers of materials. The structure of many microelectronic packages may be characterized as a multi-layered plate consisting of two regions, that of a die area and a mold area. Physical observat...

Automated Sequential Pushing of Micro Objects by Using Adaptive Controller

Received Feb 19, 2013 Revised Aug 13, 2013 Accepted Aug 29, 2013 This paper focuses on precision automated pushing of multiple micro objects. An adaptive control system is proposed to accurately push and position the micro objects on a substrate. Each micro object exhibits different characteristics in terms of the surface micro forces governing the manipulation process. The controller is design...